Diverse Accessible Heterogeneous Integration (DAHI) Foundry Technology

Archived

DARPA - Microsystems Technology Office

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Description

Amendment 02: The purpose of this amendment is to revise the proposal due date as highlighted in yellow in the attached, conformed DARPA-BAA-12-16 document. Amendment 01: The purpose of this amendment is to provide a Proposer's Day date and the associated registration website. Original Synopsis Below. The goal of the Diverse Accessible Heterogeneous Integration (DAHI)Foundry Technology BAA is to develop advanced heterogeneous integrationprocesses, allowing diverse material systems and device technologies to be tightly integrated on a common silicon substrate. The DAHI program thrustaims to establish a manufacturable foundry technology to provide accessibility to a broad community of designers for innovative circuit or microsystem designs.See the full DARPA-BAA-12-16 document attached.

Who can apply

  • Unrestricted

Contact

Dr. Sanjay Raman <br/>Program Manager
DARPA-BAA-12-16@darpa.mil

Key dates & funding
  • PostedMar 29, 2012
  • ClosesJul 23, 2012
  • Award floor$0
  • Award ceiling$0
  • CFDA12.910
Categories
Science and Technology and other Research and Development

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