Intrachip/Interchip Enhanced Cooling Fundamentals (ICECool Fundamentals)

Archived

DARPA - Microsystems Technology Office

Description

Amendment 01: The purpose of this Amendment is to revise the full proposal due date and to make technical revisions as highlighted in yellow in the attached conformed DARPA-BAA-12-50 document. Original Synopsis below. The ICECool Fundamentals thrust is the first step toward achieving the goals of the ICECool program and will develop the fundamental building blocks of intra- and interchip evaporative microfluidic cooling. ICECool Fundamentals will develop and demonstrate the microfabrication techniquesneeded to implement evaporative microfluidics in multiply-microchanneled semiconductor wafers and study, model, and correlate the thermofluidic characteristics of evaporative flows in such microchannel flow loops within individual chips and/or in the microgaps between chips in 3D stacks. See the full DARPA-BAA-12-50 document attached.

Who can apply

  • Unrestricted

Contact

Dr. Avram Bar-Cohen <br/>Program Manager
DARPA-BAA-12-50@darpa.mil

Key dates & funding
  • PostedJun 7, 2012
  • ClosesSep 13, 2012
  • Award floor$0
  • Award ceiling$0
  • CFDA12.910

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