DARPA - Microsystems Technology Office

Description

Amendment 01: The purpose of this amendment is to: 1. Revise/Correct “HEMT “hot spot” flux metric depicted throughout the BAA – primarily in Table 1 and Table 2. 2. Effect administrative/wording revisions. 3. Delete Attachment 1 and replace with a new Attachment 1 (Cost Proposal Checklist). All changes are highlighted in yellow in the attached conformed DARPA-BAA-13-21 document. Original synopsis below. ICECool is exploring disruptive thermal technologies that will mitigate thermal limitations on the operation of military electronic systems, while significantly reducing size, weight, and power consumption (SWaP). The specific goal of ICECool Applications is to enhance the performance of RF power amplifiers and embedded computing systems through the application of chip-level heat removal with kW-level heat flux and heat density with thermal control of local submillimeter hot spots, while maintaining these components in their commonly-accepted temperature range by judicious combination of intra- and/or interchip microfluidic cooling and on-chip thermal interconnects.See the full DARPA-BAA-13-21 document attached.

Who can apply

• Unrestricted

Contact

Dr. Avram Bar-Cohen <br/>Program Manager <br/>DARPA/MTO
DARPA-BAA-13-21@darpa.mil