Supply Chain Hardware Integrity for Electronics

Archived

DARPA - Microsystems Technology Office

Description

Amendment 3: The purpose of this amendment is to re-set the BAA close date in Grants.gov from May 30, 2014 to September 30, 2014 in accordance with Part II, Section IV, paragraph 6 of DARPA-BAA-14-16. The BAA remains unchanged. Amendment 2: The purpose of this amendment is to further clarify/establish the SHIELD program objectives depicted in Part II, Section I of the Broad Agency Announcement (BAA). All changes are highlighted in yellow in the attached conformed DARPA-BAA-14-16 document.Amendment 1: The purpose of Amendment 1 is to establish, in the BAA document, a time of 4pm EST for abstract and proposal submission. This Amendment also clarifies abstract content instructions and deletes and replaces the "Technical Rationale and Approach" paragraph stipulated in the Detailed Proposal Information section. All changes to DARPA-BAA-14-16 are highlighted in yellow in the attached conformed document. Original synopsis below. DARPA is soliciting innovative research proposals in the area of supply chain protection ofelectronic components. Proposed research should investigate innovative approaches that enablerevolutionary advances in science, devices, or systems. See the full DARPA-BAA-14-16 document attached.

Who can apply

  • Unrestricted

Contact

Mr. Kerry Bernstein <br/>DARPA Program Manager
DARPA-BAA-14-16@darpa.mil

Key dates & funding
  • PostedMar 3, 2014
  • ClosesSep 30, 2014
  • Award floor$0
  • Award ceiling$0
  • CFDA12.910

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