Magnetic Miniaturized and Monolithically-Integrated Components (M3IC)

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DARPA - Microsystems Technology Office

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Description

The DARPA Microsystems Technology Office is soliciting innovative research proposals to develop integrated magnetic components on semiconductor substrates that will reduce size and enable new functionality for U.S. Department of Defense (DoD) electromagnetic (EM) systems. Proposals will focus on one or more of the following technical areas: 1) integration of magnetic components on semiconductor substrates, 2) modeling the system-level impact of nonlinear, non-reciprocal, time-dependent magnetic phenomena, and 3) optimization of miniaturized microwave magnetic components. Specifically excluded is research that primarily results in evolutionary improvements to the existing state of practice.

Who can apply

  • Unrestricted

Contact

Dr. William D. Palmer <br/>DARPA Program Manager
DARPA-BAA-16-36@darpa.mil

Key dates & funding
  • PostedJun 16, 2016
  • ClosesAug 1, 2016
  • Program funding$26,000,000
  • CFDA12.910
Categories
Science and Technology and other Research and Development

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