Common Heterogeneous Integration and IP Reuse Strategies (CHIPS)

Archived

DARPA - Microsystems Technology Office

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Description

Amendment 02: The purpose of this amendment is to add a header to the Full Proposal Format section. See the changes as highlighted in yellow in the attached conformed DARPA-BAA-16-62 document. Amendment 01: The purpose of this amendment is to update the Proposal Due Date and FAQ Deadline. See the changes as highlighted in yellow in the attached DARPA-BAA-16-62 document.Original Synopsis Below.The Common Heterogeneous Integration and Intellectual Property (IP) Reuse Strategies (CHIPS) program will develop the design tools and integration standards required to demonstrate modular integrated circuit (IC) designs that leverage the best of DoD and commercial designs and technology.See the attached DARPA-BAA-16-62 document.

Who can apply

  • Unrestricted

Contact

Dr. Daniel Green <br/>MTO Program Manager
DARPA-BAA-16-62@darpa.mil

Key dates & funding
  • PostedSep 29, 2016
  • ClosesJan 13, 2017
  • CFDA12.910
Categories
Science and Technology and other Research and Development

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