Photonics in the Package for Extreme Scalability (PIPES)

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DARPA - Microsystems Technology Office

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Description

Amendment 02: The purpose of this amendment is to extend the proposal due date. Original Synopsis below. The DARPA Microsystems Technology Office is soliciting research proposals for the development of package-level optical signaling technologies for advanced microelectronic systems to enable disruptive performance scaling through parallelism.

Who can apply

  • Others

Contact

BAA Coordinator<br/>HR001119S0004@darpa.mil
HR001119S0004@darpa.mil

Key dates & funding
  • PostedOct 31, 2018
  • ClosesMar 1, 2019
  • CFDA12.910
Categories
Science and Technology and other Research and Development

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