Low Temperature Logic Technology (LTLT)

Archived

DARPA - Microsystems Technology Office

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Description

Amendment 01: The purpose of this amendment is to clarify errors in Section IV.B.6. “Approved Cost Accounting System Documentation,” and Section IV.B.9. “Small Business Subcontracting Plan.” The DARPA Microsystems Technology Office is soliciting research proposals for the development of low temperature (77K) FinFET technology to achieve a 25X improvement in the performance/power of state-of-the-art (SOA) central processing units (CPU) compared to room temperature (RT) operation.

Who can apply

  • Others

Contact

BAA Coordinator<br/>HR001121S0019@darpa.mil
HR001121S0019@darpa.mil

Key dates & funding
  • PostedMar 10, 2021
  • ClosesMay 18, 2021
  • CFDA12.910
Categories
Science and Technology and other Research and Development

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