Next-Generation Microelectronics Manufacturing (NGMM)

Archived

DARPA - Microsystems Technology Office

Description

Amendment 02 - The purpose of this amendment is to extend the Full Proposal Due Date to October 12, 2022. The NGMM program will establish a domestic center for R&D and manufacturing 3DHI (three-dimensional heterogeneous integration) microsystems through a subsequent Program Solicitation. The NGMM program will consist of three phases. Phase 0 research for this program (solicited through this HR001122S0050 BAA) will inform planning for the 3DHI manufacturing center by defining exemplar 3DHI microsystems and identifying the equipment, process, and facility requirements for manufacturing these microsystems. The NGMM program plans to establish the 3DHI manufacturing center through a separate, future solicitation.

Who can apply

  • Others

Contact

BAA Coordinator<br/>HR001122S0050@darpa.mil
HR001122S0050@darpa.mil

Key dates & funding
  • PostedAug 5, 2022
  • ClosesOct 12, 2022
  • CFDA12.910

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