Miniature Integrated Thermal Management Systems for 3D Heterogeneous Integration (Minitherms3D)

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DARPA - Microsystems Technology Office

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Description

The Minitherms3D program seeks to revolutionize thermal management for three-dimensional heterogeneous integration (3DHI). This program seeks to significantly reduce thermal resistances within the 3D stack and external to the stack of 3DHI systems, while increasing volumetric heat removal.

Who can apply

  • Others

Contact

BAA Coordinator<br/>HR001123S0019@darpa.mil
HR001123S0019@darpa.mil

Key dates & funding
  • PostedJan 23, 2023
  • ClosesApr 11, 2023
  • CFDA12.910
Categories
Science and Technology and other Research and Development

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