FY2024 CHIPS R&D National Advanced Packaging Manufacturing Program (NAPMP) Materials & Substrates

Archived

National Institute of Standards and Technology

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Description

The CHIPS Research and Development Program (CHIPS R&D) aims to advance the development of semiconductor technologies and to enhance the competitiveness of the U.S. semiconductor industry. This is the first Notice of Funding Opportunity under this program. It seeks applications for new research and development (R&D) activities to establish and accelerate domestic capacity for advanced packaging substrates and substrate materials, a key technology for producing microelectronics systems.

Who can apply

  • Others

Contact

Misty L Roosa <br/>Management Analyst
grants@nist.gov

Key dates & funding
  • PostedFeb 28, 2024
  • ClosesJul 3, 2024
  • CFDA11.042
Categories
Science and Technology and other Research and Development

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