Self-HEALing mixed-signal Integrated Circuits (HEALICs)
ArchivedDARPA - Microsystems Technology Office
Description
The purpose of this modification is to extend the due date of the Full proposals to 9 September 2008 and to add an attachment. See the attached conform BAA document. Original notice below.DARPA is soliciting innovative research and development (R&D) proposals in the area of self-healing mixed signal Integrated Circuits (ICs)/Systems-on-a-Chip (SoCs). The goal of the program is the development of techniques to maximize the number of fully operational mixed-signal SoCs on an individual wafer that meet all performance goals in the presence of extreme process variations and environmental conditions. See attached full BAA document. Submit your questions to BAA08-40@darpa.mil
Who can apply
- Unrestricted
Contact
Dr. Sanjay Raman <br/>DARPA Program Manager <br/>Microsystems Technology Office <br/>3701 North Fairfax Drive <br/>Arlington, VA 22203-1714 <br/>Fax: (703) 248-8062 <br/>Phone: (571) 218-4339 <br/> <br/>
BAA08-40@darpa.mil
- PostedMay 21, 2008
- ClosesMay 19, 2009
- Award floor$0
- Award ceiling$0
- CFDA12.910
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