DARPA - Microsystems Technology Office

Description

DARPA is soliciting innovative research proposals to develop an infrared imaging system that operates over a bandwidth extending from 0.5 to 5.0 microns and a resolution of 1024 x 1024 pixels. The focal plane array (FPA) of this imaging system must exhibit a high detectivity and low noise equivalent temperature at 200K. Each sub-element in each pixel array will be three dimensional (3D) semiconductor pillar structure, using either a top-down or bottom-up process scheme. The motivation for this 3D sub-element design is to significantly increase photon trapping, and their subsequent absorption and generation of electron-hole pairs in the absorber material. All administrative correspondence and questions on this solicitation, including requests for information on how to submit a proposal abstract or full proposal to this BAA, should be directed to the administrative addresses below; e-mail or fax is preferred. BAA08-64@darpa.mil. DARPA intends to use electronic mail and fax for correspondence regarding DARPA-BAA-08-64 Proposals and proposal abstracts may not be submitted by fax or e-mail; any so sent will be disregarded. See Full DARPA-BAA-08-64 document attached.

Who can apply

• Unrestricted

Contact

Nibir Dhar <br/>ATTN: DARPA-BAA-08-64 <br/>FAX: 703-696-2206 <br/>
BAA08-64@darpa.mil